The following is a guide to proper application of high bond tape.
This ensures the maximum bond and high performance. Incorrect application of high bond tapes can affect adhesion and functionality.
- Both bonding surfaces must be unified, clean and dry to obtain optimum adhesion.
- Most surfaces are best cleaned by using a 50:50 mixture of isopropyl alcohol (IPA) and water. This is a safe and common solution.
- IPA/water solution will clean light oil, films and other dirt.
- Glass bonding - use a coupling agent to clean and treat glass surfaces.
Things to Watch Out For
(less than optimal conditions)
- Dirty surfaces - dust, oil, dirt, etc.
- Low temperatures - apply high bond tape at 50 F˚ (10 C˚) or higher for maximum bonding results
- Material temperature - avoid the risk of water droplets and condensation on substrate surface
- Low surface energy (LSE) materials - silicone paints, plastic, etc.
Applying High Bond Tape to Substrates
- Firm application pressure creates a greater amount of surface contact and a stronger bond.
- Apply tape to the first surface using light finger pressure or use a hand roller to ensure good wet-out and remove entrapped air.
- Remove the liner, align the parts and apply second substrate immediately to exposed tape.
- Once liner is removed, avoid touching the adhesive with fingers or other tools, as this may allow dirt and dust to get on the tape surface.
- Apply pressure to bonded parts.